Morris, J. W., Jr. Department of Materials Sciences and Mineral Engineering, University of California, Berkeley, California.
- Solder alloys
- Circuit assembly
- Solder joint metallurgy
- Related Primary Literature
- Additional Reading
A low-temperature metallurgical joining method in which the solder (joining material) has a much lower melting point than the surfaces to be joined (substrates). Because of its lower melting point, solder can be melted and brought into contact with the substrates without melting them. During the soldering process, molten solder wets the substrate surfaces (spreads over them) and solidifies on cooling to form a solid joint.
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